Liquid metal-based TIMs for chiplet packaging

We are conducting research on a gallium-based liquid metal alloy incorporating oxide-free copper for enhanced thermal conductivity. The gallium-based liquid metal alloy engineered with copper nano-particles provides approximately three times higher thermal conductivity than conventional liquid metals. Moreover, the integration of the liquid metal within porous copper forms a stable Thermal Interface Material (TIM) that prevents the leakage of liquid metal, thus presenting a strong potential for various heat dissipation solutions.