Micro/nanoscale phase-change physics
Intelligent thermal management for chiplet AI semiconductors and data centers
Intelligent thermal management for next-generation mobility and
defense technologies
Nanoengineered thermal materials for enhanced heat transfer
Nanoengineered thermal materials for controlling energy transfer
Liquid metal-based TIMs for chiplet packaging
We are conducting research on a gallium-based liquid metal alloy incorporating oxide-free copper for enhanced thermal conductivity. The gallium-based liquid metal alloy engineered with copper nanoparticles provides approximately three times higher thermal conductivity than conventional liquid metals. Moreover, we are currently investigating high-performance thermal interface materials by incorporating thermally conductive BAs particles into gallium-based liquid metals and by infusing gallium-based liquid metals into copper micro/nanostructures, aiming to enhance thermal transport while maintaining structural stability and minimizing liquid metal leakage.
[1] S. Ki, J. Shim, S. Oh, E. Koh, D. Seo, S. Ryu, J. Kim, Y. Nam, Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials. International Journal of Heat and Mass Transfer 2021;170:121012. Link.