Jet impingement boiling for chiplet semiconductors

Energy efficiency is a crucial part of thermal management issues in the modern era. Forced air cooling has been the most economic and widely applicable solution for devices for the past decades. However, as the chip performance increases with semiconductor miniaturization, the heat flux emitted by the newest chips far exceed the cooling capacity of air cooling. Multi-phase cooling utilizing the latent heat of a phase change phenomenon has proven to be the go to solution for energy efficient effective cooling. Compared to single phase liquid cooling (mostly utilizing water), two phase cooling (uses dielectric fluids with a boiling temperature of around 50~70°C) requires less energy to finally eject heat to the final heat reservoir (typically the atmosphere). Our objective is to provide a two-phase jet impingement cooling solution, and compare its thermohydraulic performance to single-phase jet impingement cooling.