Tailoring supercooling for liquid-metal thermal storage materials

We introduce a novel approach to address the challenges associated with Ga-based phase change materials (PCMs) in the field of electronics thermal regulation. In this study, we aim to overcome the supercooling phenomenon that affects the performance of Ga-based PCMs by developing a porous Cu/Ga composite. This composite structure not only enhances heat conduction but also promotes heterogeneous nucleation, leading to improved thermal regulation performance over repeated heating-cooling cycles. Our innovative solution holds promise for efficient and reliable electronics thermal management.