Immersion cooling for chiplet packaging

The industry has consistently improved chip performance through semiconductor miniaturization. As semiconductor circuit line widths shrink to a few nanometers, further miniaturization becomes challenging. Moving forward, the solution may not lie in increasing the number of transistors but in exploring '3D chiplet-packaging' technologies. With the emergence of 3D chiplet systems, the thermal issue continues to be one of the most critical challenges. Among various solutions, two-phase immersion cooling emerges as one of the most promising cooling technologies to address this issue. Our primary objective is to predict performance based on packaging design and optimize it. Also, to evaluate both boiling and condensation performances from a holistic system perspective of two-phase immersion cooling, all with the aim of optimizing efficiency and effectiveness.